Capabilities
Overview & Capabilities
World class manufacturing services hinge on state of the art facilities and a truly competent professional team. Raneal Advanced Systems manufacturing facility is located in Bangalore, with a total of 40,000 Sqft. of production area. We have developed and invested in many new processes and capabilities to meet the most complex and critical requirements of our customer.
At Raneal Advanced Systems, we have automated IT tools and technologies to manage the complete shop floor system with product traceability back to each phase of the manufacturing process.
We provide a full range of test solutions be it to board level or complete system. We identify and implement the most suitable test strategy to deliver a fully working, quality product.
Advanced Manufacturing Capabilities
Fully automatic SMT Line
IPC 610 Class 2 & 3 Assembly
Clean & No-Clean Process
PBGA (PITCH BALL GRID ARRAY) and FBGA(FINE BALL GRADE ARRAY) to 0.5mm
PoP (Package over Package)
Through Hole & SMT Mixed
Leadless Chip
Fine Pitch (0201 & 01005)
Multi-Chip Modules
Conformal Coating – Manual
Automated cleaning solutions
Selective Soldering
Potting
High Melting Point Solder
HMLV (high-mix low-medium-volume) PCB Assembly
Complete end product assembly
Box Build / Final Assembly / System Integration
BGA Rework
Flex Rigid PCB Assembly
PressFit
Automated PCBA De-Paneling
Test Capabilities
Automatic Solder Paste Inspection
Automatic Optical Inspection
3D X-RAY Inspection
Ionic Contamination Test
In-Circuit Test
Flying Probe Test
Boundary Scan Test
HASS Test
Vibration Test
Functional Testing

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