Capabilities

Overview & Capabilities

World class manufacturing services hinge on state of the art facilities and a truly competent professional team. Raneal Advanced Systems manufacturing facility is located in Bangalore, with a total of  40,000 Sqft. of production area. We have developed and invested in many new processes and capabilities to meet the most complex and critical requirements of our customer.

At Raneal Advanced Systems, we have automated IT tools and technologies to manage the complete shop floor system with product traceability back to each phase of the manufacturing process.

We provide a full range of test solutions be it to board level or complete system. We identify and implement the most suitable test strategy to deliver a fully working, quality product.

Advanced Manufacturing Capabilities

Fully automatic SMT Line

IPC 610 Class 2 & 3 Assembly

Clean & No-Clean Process

PBGA (PITCH BALL GRID ARRAY) and FBGA(FINE BALL GRADE ARRAY) to 0.5mm

PoP (Package over Package)

Through Hole & SMT Mixed

Leadless Chip

Fine Pitch (0201 & 01005)

Multi-Chip Modules

Conformal Coating – Manual

 Automated cleaning solutions

Selective Soldering

Potting

High Melting Point Solder

HMLV (high-mix low-medium-volume) PCB Assembly

Complete end product assembly

Box Build / Final Assembly / System Integration

BGA Rework

Flex Rigid PCB Assembly

PressFit

Automated PCBA De-Paneling

Test Capabilities

Automatic Solder Paste Inspection

Automatic Optical Inspection

3D X-RAY Inspection

Ionic Contamination Test

In-Circuit Test

Flying Probe Test

Boundary Scan Test

HASS Test

Vibration Test

Functional Testing

Comments are closed.